Micro-LED\u00a0<\/strong><\/span><\/h3>\n<\/div><\/div><\/div><\/div><\/div>Micro-LED \u2014LEKIN-SiMiP\u00ae<\/strong><\/span><\/h4>\n<\/div><\/div><\/div><\/div><\/div>The LEKIN-SiMiP\u00ae direct-view chip is the core achievement of Lichen Semiconductor in overcoming the challenges of Micro-LED mass production. This technology is based on a silicon-based GaN material platform and uses a pixelated LED chip plus wafer-level color conversion technology route, integrating red, green, and blue subpixels into a single chip, with each pixel independently controlling light without crosstalk, truly achieving full-color display on a single chip. Compared with traditional Micro-LED solutions, this technological path fundamentally avoids critical processes such as ‘mass transfer’ and ‘mass repair,’ realizing a process innovation of ‘one-time die bonding, zero mass transfer.’ This not only streamlines production steps and effectively improves product yield, but also significantly reduces production costs. At the same time, the chip also possesses core advantages such as high reliability, high uniformity, low power consumption, and high luminous efficacy.<\/p>\n<\/div>
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Micro-LED \u2014LEKIN-SiMiP\u00ae<\/strong><\/span><\/h4>\n<\/div><\/div><\/div><\/div><\/div>The LEKIN-SiMiP\u00ae direct-view chip is the core achievement of Lichen Semiconductor in overcoming the challenges of Micro-LED mass production. This technology is based on a silicon-based GaN material platform and uses a pixelated LED chip plus wafer-level color conversion technology route, integrating red, green, and blue subpixels into a single chip, with each pixel independently controlling light without crosstalk, truly achieving full-color display on a single chip. Compared with traditional Micro-LED solutions, this technological path fundamentally avoids critical processes such as ‘mass transfer’ and ‘mass repair,’ realizing a process innovation of ‘one-time die bonding, zero mass transfer.’ This not only streamlines production steps and effectively improves product yield, but also significantly reduces production costs. At the same time, the chip also possesses core advantages such as high reliability, high uniformity, low power consumption, and high luminous efficacy.<\/p>\n<\/div>
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The LEKIN-SiMiP\u00ae direct-view chip is the core achievement of Lichen Semiconductor in overcoming the challenges of Micro-LED mass production. This technology is based on a silicon-based GaN material platform and uses a pixelated LED chip plus wafer-level color conversion technology route, integrating red, green, and blue subpixels into a single chip, with each pixel independently controlling light without crosstalk, truly achieving full-color display on a single chip. Compared with traditional Micro-LED solutions, this technological path fundamentally avoids critical processes such as ‘mass transfer’ and ‘mass repair,’ realizing a process innovation of ‘one-time die bonding, zero mass transfer.’ This not only streamlines production steps and effectively improves product yield, but also significantly reduces production costs. At the same time, the chip also possesses core advantages such as high reliability, high uniformity, low power consumption, and high luminous efficacy.<\/p>\n<\/div>
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