Micro-LED\u00a0<\/strong><\/span><\/h3>\n<\/div><\/div><\/div><\/div><\/div>Micro-LED \u2014LEKIN-SiMiP\u00ae<\/strong><\/span><\/h4>\n<\/div><\/div><\/div><\/div><\/div>The LEKIN-SiMiP\u00ae chip is a core achievement of Lichen Semiconductor in overcoming the mass production challenges of Micro-LEDs. This chip uses a silicon-based gallium nitride material platform and integrates RGB primary colour pixels on a single chip. Combined with wafer-level colour conversion technology, it enables high-quality full-colour Micro-LED displays. This innovative approach fundamentally avoids the ‘mass transfer’ and ‘mass repair’ steps in traditional Micro-LED manufacturing, achieving process innovation with ‘one-time die bonding and zero mass transfer’. This breakthrough not only significantly improves production yield but also provides an overall cost advantage of over 30%, laying a solid foundation for the large-scale application of Micro-LED technology.<\/p>\n<\/div><\/div><\/div>
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Micro-LED \u2014LEKIN-SiMiP\u00ae<\/strong><\/span><\/h4>\n<\/div><\/div><\/div><\/div><\/div>The LEKIN-SiMiP\u00ae chip is a core achievement of Lichen Semiconductor in overcoming the mass production challenges of Micro-LEDs. This chip uses a silicon-based gallium nitride material platform and integrates RGB primary colour pixels on a single chip. Combined with wafer-level colour conversion technology, it enables high-quality full-colour Micro-LED displays. This innovative approach fundamentally avoids the ‘mass transfer’ and ‘mass repair’ steps in traditional Micro-LED manufacturing, achieving process innovation with ‘one-time die bonding and zero mass transfer’. This breakthrough not only significantly improves production yield but also provides an overall cost advantage of over 30%, laying a solid foundation for the large-scale application of Micro-LED technology.<\/p>\n<\/div><\/div><\/div>
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The LEKIN-SiMiP\u00ae chip is a core achievement of Lichen Semiconductor in overcoming the mass production challenges of Micro-LEDs. This chip uses a silicon-based gallium nitride material platform and integrates RGB primary colour pixels on a single chip. Combined with wafer-level colour conversion technology, it enables high-quality full-colour Micro-LED displays. This innovative approach fundamentally avoids the ‘mass transfer’ and ‘mass repair’ steps in traditional Micro-LED manufacturing, achieving process innovation with ‘one-time die bonding and zero mass transfer’. This breakthrough not only significantly improves production yield but also provides an overall cost advantage of over 30%, laying a solid foundation for the large-scale application of Micro-LED technology.<\/p>\n<\/div><\/div><\/div>
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